Automotive Embedded Systems – Body Electronics                               
Automotive Embedded Systems – Body Electronics




Features
Features

Mechatronic test benches − Growing trend for validating control systems
Mechatronic test benches − Growing trend for validating control systems

To validate complex vehicle control systems the mechanical components must be put to the test, which can be a time-consuming and expensive process. As automotive manufacturers look for more efficient solutions, there is a growing trend towards utilizing mechatronic test benches.


Product Line Engineering: Intelligent manufacturing for intelligent products
Product Line Engineering: Intelligent manufacturing for intelligent products

"Automotive manufacturers must deliver an ever-growing array of options and variants in their vehicle product line offerings. If an automotive company sold a fleet of 30 million vehicles last year, this equates to hundreds of thousands of different vehicle configurations. With the Internet of Things (IoT), there must now be a digital twin for all of these configurations, representing each of the vehicles in the field," explains Dr. Charles Kruger, CEO of product line engineering firm BigLever Software.


The complexities of body electronics today and tomorrow
The complexities of body electronics today and tomorrow

Body electronics systems embrace a wide variety of applications, addressing everything from driver and passenger comfort and security to high-performance computing and in-vehicle networking. Even with such a broad range of offerings, customers still expect reasonably priced electronic components with the highest levels of both quality and reliability.


Autonomous drive by 2020: Over-promised, under-delivered?
Autonomous drive by 2020: Over-promised, under-delivered?

A look at the future vehicle through the eyes of SAE International.


See How System-on-Modules Can Improve Your Wireless Designs

Sponsored by: Digi International and Digi-Key
March 29, 11am ET


Blogs & Columns
Blogs & Columns

Revisiting radio tuners in car head units></a></td>
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Revisiting radio tuners in car head units

In a traditional architecture, multiple radio tuner front ends are connected to the head unit via analog cables, which are inherently susceptible to noise and heat dissipation while transporting signals from antenna to head unit. Additionally, each tuner requires its own baseband hardware. What Maxim brings to the table is a remote tuner solution that is positioned near the antenna to free up space in the head unit..


DSPs go way beyond improving a car’s audio></a></td>
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DSPs go way beyond improving a car’s audio

As more communications functions are added to cars and more functions become automated, digital signal processing (DSP) is finding uses far beyond traditional audio. These new applications help make cars more comfortable, more reliable, and safer.


Connected cars: eCall systems kickstart V2I agenda></a></td>
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Connected cars: eCall systems kickstart V2I agenda

Now that Europe has mandated the eCall systems for all new cars by 2018, expect silicon solutions that further push the vehicle-to-infrastructure (V2I) agenda later this year.


Executive Outlook
Executive Outlook

Diverse, distributed architecture approaches leave automotive body electronics open to innovation
Diverse, distributed architecture approaches leave automotive body electronics open to innovation

Though certain domains of the modern vehicle are offloading subsystem functions to fewer, large domain controllers, the body electronics domain remains a heterogeneous mix of control area networks (CAN), local interconnect networks (LIN), and now even Ethernet. As automakers begin to reclaim vehicle architecture definition from Tier 1 suppliers, they are taking different approaches to the design and architecture of body electronics subsystems, which Arun Vemuri, Sector General Manager for Automotive Body Electronics and Lighting and Mike Claassen, Sector General Manager for Automotive Infotainment, both of Texas Instruments, explain in this interview.



Marketplace
Marketplace

embedded world 2017: CAN FD enters M.2, other form factors></a></td>
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embedded world 2017: CAN FD enters M.2, other form factors

At embedded world 2017 in Nuremberg, Germany, PEAK-System Technik will release what the company claims is the first CAN FD interface available in an M.2 form factor, the PCAN-M.2. The PCAN-M.2 will be available in single, dual, and quad-channel versions.



AEC-Q101-qualified surface mount TVS diodes from Littelfuse safeguard sensitive automotive electronics></a></td>
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AEC-Q101-qualified surface mount TVS diodes from Littelfuse safeguard sensitive automotive electronics

The diodes provide a 7000 W or 2200 W peak pulse power dissipation rating in a surface mount SMTO-263 package and meets ISO 7637-2 5A/5B protection and ISO 16750 load dump tests.


WHITE PAPER: Key considerations for powertrain HIL test></a></td>
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WHITE PAPER: Key considerations for powertrain HIL test

Safety, availability, and cost considerations can make performing thorough tests of embedded control devices using the complete system impractical. Hardware-in-the-loop (HIL) simulation is a real-time test technique used to test these devices more efficiently.


MIPI Alliance introduces Discovery and Configuration (DisCo) base architecture, class specifications for automotive, IoT, mobile></a></td>
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MIPI Alliance introduces Discovery and Configuration (DisCo) base architecture, class specifications for automotive, IoT, mobile

MIPI DisCo base specification defines a uniform software architecture that can be used with a device’s host operating system to discover, enumerate, and manage controllers, buses, and other components that use MIPI Alliance specifications.




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