IoT Design Weekly – 01.13.2017 – Chips, Kits, & Tools  
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IoT Design Weekly – 01.13.2017 – Chips, Kits, & Tools

Features

Free MakerPro stuff: What’s the real cost?
Free MakerPro stuff: What’s the real cost?

If part of or all of your business is showing off what you made to the world, as you gain some semblance of influence, companies may offer you free items to use in videos or to otherwise promote. Sometimes it’s great, sometimes it’s not, and sometimes, even though it’s a good product, you probably would have been better off just buying it rather than figuring out how to get it for free.

Mobile Device Trends in the Internet of Things

Sponsored by: Ayla Networks and Cardinal Peak
January 19, 2pm ET

Choose a DSP for increasingly diverse IoT applications, part 1
Choose a DSP for increasingly diverse IoT applications, part 1

Chip designers are now under pressure to deliver new IoT technologies, and their success will depend on the ability to effectively deploy these new technologies within the design constraints of products that need to be small, mobile, low power, and connected.

New functionality in RTOSs puts the focus on security
New functionality in RTOSs puts the focus on security

From its humble beginning as an interrupt-driven, multitasking kernel with some I/O support, the modern real-time operating system has evolved into an essential, sophisticated element for the development of connected embedded systems in the Internet of Things.

Hardware developers: Take a cue from your software brethren
Hardware developers: Take a cue from your software brethren

Using the right reference design can save substantial time in each of the steps that you and your project team members must complete to turn your ideas into working products.

Blogs and Columns

CES 2017: Bluetooth 5 coming to T.I. designers
CES 2017: Bluetooth 5 coming to T.I. designers

Adopted by the Bluetooth SIG at the tail end of 2016, Bluetooth 5 technology has sparked a significant amount of interest in the short-range wireless space thanks to its significant performance improvements over previous versions of the technology.

CES 2017: Bosch XDK turns sensors into solutions
CES 2017: Bosch XDK turns sensors into solutions

Among the Sensortec sensors included in the Bosch XDK are an accelerometer, gyroscope, magnetic sensor, ambient light sensor, and noise, pressure, and temperature sensors, which are accessible through a 20-pin extension header, debug port, MicroUSB connector, and programmable push buttons.

CES 2017: Cypress multi-protocol wireless SoCs just first step in flexible, cloud-connected IoT apps
CES 2017: Cypress multi-protocol wireless SoCs just first step in flexible, cloud-connected IoT apps

One of the most significant developments in the world of wireless connectivity for the Internet of Things of late has been the advent of multi-protocol wireless system on chips, and at CES 2017 they were in no short supply.

Executive Outlook

I3C: An upgraded interface for a world of sensors

The Improved Inter-Integrated Circuit (I3C) is a next-generation chip-to-chip interconnect capable improved performance, power consumption, and cost compared to legacy buses such as SPI, UART, and I2C, and is geared at mobile, wearables, and you guessed it, the Internet of Things. Ken Foust, Chair of the MIPI Alliance Sensor Working Group, explains.

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Marketplace

Barr Group announces Spring 2017 Embedded Systems Training calendar
Barr Group announces Spring 2017 Embedded Systems Training calendar

"Boot Camps" on embedded software, security, and Android, as well as two new comprehensive courses offered

Kudelski Group launches IoT Security Center of Excellence for increased protection of connected devices
Kudelski Group launches IoT Security Center of Excellence for increased protection of connected devices

Security pioneer leverages more than 20 years of expertise in protecting devices and content to bring customers end-to-end approach for overcoming emerging threats and capitalizing on the lucrative IoT market.

MIPI Alliance releases MIPI I3C sensor interface specification
MIPI Alliance releases MIPI I3C sensor interface specification

MIPI I3C solves engineering community's pressing need for a new chip-to-chip interface that integrates sensors in smartphone, IoT, automotive and other product designs.

Leti to demonstrate multi-carrier waveform for 5G networks
Leti to demonstrate multi-carrier waveform for 5G networks

Six-month field trials will use multi-service transmission at 3.5 GHz TDD band.

Meeami Technologies, Qualcomm, and XMOS enable enhanced voice recognition for Amazon Alexa Voice Services and IoT applications
Meeami Technologies, Qualcomm, and XMOS enable enhanced voice recognition for Amazon Alexa Voice Services and IoT applications

The joint demonstration showed ClearVoice-powered AVS integration for a range of home IoT applications.

Senet, STMicro, myDevices showcase LPWAN technology at CES
Senet, STMicro, myDevices showcase LPWAN technology at CES

Illustrating the ability to rapidly deploy commercial LPWAN and the ease in which fully functional real-world IoT solutions can be brought to market, this live, real-time demonstration showed LoRa technology in action.

 
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